4/14/12

Computer components and functions

A. 1. PC CardExpansion cards are typically used in notebooks, so the notebook has new functions such as WLAN, Bluetooth, Sound, and others. PC Card is divided into three types. Type I, Type II and Type III. The difference in shape between the three, only the thickness is at the level of each card. Type I, which has a thickness of 3.3 mm is usually used as a memory card. Type II with a thickness of 5 mm is usually used for devices that serve as I / O such as modem, LAN, and lainlainnya. For Type III, with a thickness of 10.5 mm is usually used for devices such as micro drives or other components which have a thickness dimension.

A. 2. Touchpad
Is an input device commonly used on laptop computers. Function as a mover the cursor on the monitor via the stimulation of touch gestures touchpad. This function is also used as a replacement touchpad mouse. Of sizes, usually have different sizes, but usually not more than 50 cm ².

   
A. 3. SO-DIMM
Small Outline DIMM stands, is a smaller version of a standard DIMM, commonly used in notebook computers. Where, SO-DIMM has a size of 72 pin to 32-bit interface, and 144 pin for 64-bit interface.

   
A. 4. Motherboard
         
A. a. Chipset
Chips or chipsets are tiny pieces of silicon that is used for storing information and instructions Every computer has at least a component of a computer chip in it. Chipset on the motherboard that controls the basic input and output of the computer. Chipset on the video card controls the rendering of 3D pornography k and output of the image on your monitor. One example of the CPU chip is very important.

   
A. b. Controller
Additional tools that can regulate the operation of existing equipment under the motherboard settings. Physical form of a chip with a variety of sizes, depending on its functions and facilities.

   
A. c. FSB (Front Side Bus)
In the microprocessor FSB connects the processor with main memory. FSB is used to communicate between the motherboard with the other components.

   
A. d. HSF (Heat Sink Fan)
CPU component that is used to minimize heat. Usually made of aluminum. The use of repellent active fan heat from the heatsink. With the chipset is still cold, it will improve the performance of the computer work.

   
A. e. Integrated Graphics Controller
Usually called IGP (Integrated Graphics Port) by some chipset manufacturers. Is an integrated graphics chip on the motherboard chipset and has the same function as the video card. The difference is, most of the IGP does not have a special memory for him, and taking it directly from the main computer memory. Although the majority manufacturer will implement a special memory chip for this IGP.

   
A. f. Northbridge
One of the two chips in the chipset that connects the processor to the memory system and bus AGP / PCI and PCI-ex. The other is the southbridge chip.

   
A. g. Slot
A place to put additional peripheral devices on the motherboard. For example, an AGP slot for video card, ISA slot DIMM slots for memory modules, and so on.

   
A. h. Socket
Almost the same as the slot, it's just plain a processor holder, a stretch of two-dimensional matrix. Ma singmasing producer and processor type has a different pin number. Example: Socket A (462 pin) Socket 754, Socket 939, Socket AM2 (940 pin) on the AMD processor.

   
A. i. Southbridge
One of the two chips in the chipset that controls the IDE bus, USB, support Plug and Play, PCI and ISA bridge the keyboard and mouse control, power management features, and other devices.

   
A. 5. Video Card
         
A. a. Anti-Aliasing
The process of eliminating or at least reduce the effect of jaggies (sharp corners) on a display renderring results. So it looks more realistic appearance.

   
A. b. Clock
The value of working speed electrical signals in the network of electronic components or also on a chip within a certain time. These values ​​are usually expressed in Hertz (Hz), MHz sample.

   
A. c. DirectX
Is the API (Application Programming Interface) used by Microsoft in its Windows operating system to communicate with hardwarehardware for PC control. For its own hardware, necessary software drivers that support DirectX to get it working optimally. On display and graphics business using DirectDraw and Direct3D, which is part of DirectX.

   
A. d. Entry-level
Segments of a product that is at the lowest class in the scope of the level of technology. Offer price is relatively affordable, but a bit limited in the facility and speed performance.

   
A. e. GPUGraphics Processing Unit or usually called Visual Processing Unit (VPU), is a chip designed for PCs and game consoles are special function as a processor / grafi s rendering of data. Where in addition to the data 2D, also for data that has a geometry transformation (3D).

   
A. f. HDRHigh Dynamic Range lighting renderring is a procedure designed to emulate how levellevel light varies in the real world for a wide range of areas. This is usually obtained by using the data for the fl oating-point textures and targets that will be rendered also include the use of appropriate lighting algorithm. Despite offering a more interesting visual effect, but to enable this effect has a considerable performance hit for most VGA.

   
A. g. HeatpipeThe design of cooling components made of tubular metal. He serves dissipate heat from one end to another. Dissipate heat in this, a special dye is used in it.

   
A. h. Pixel Pipeline
Unit of a GPU, the site of information transfer and processing pixel. Where, the more pixel pipelines, so the more the number of pixels that can be processed by the GPU.

   
A. i. Vertex Processor
Vertex pipeline vertex processor or unit is one of the GPU that serves as a carrier of information geometry (in the form of vector points), or also directly process them if necessary. Processing itself can be in the form of fixed function (the DirectX 7.0 down), or in the form of hard-wired with the vertex shader function (up to the latest DirectX 8.0).

   
A. 6. RAM
         
A. a. Access Time, Timing
A measurement of time in nanoseconds (ns) are used to indicate the speed of a memory Access Time is specified, the first time in the start time CPU sends data to a memory request to the CPU receives the data requested.

   
A. b. Bandwidth
A maximum capacity to move data in an electronic network, such as Bus or Channel. More in short, that is the maximum amount of data that can be moved in within a certain time unit. Bandwidth is usually expressed in units of bits, bytes, or Hertz.

   
A. c. Bank SchemaA large set of configuration memory in the form of diagrams. System of the Bank Schema consists of rows (rows) and columns (fields) that describe the memory sockets within a computer system. Where, rows indicate the different sockets and columns indicate the number of banks that exist in each socket.

   
A. d. Buffered
Buffered means adding this additional logic components, or the drivers into a SIMM or DIMM to increase the output current. This is done to avoid a reduction in signal quality of data resulting from the capacitance. Memory modules which include the type of "buffered", usually have small buffer chipchip mounted inside the module.

   
A. e. Burst ModeIs a technique of continuous data transfer, which automatically generates a data block (in the form of an unbroken line of address / serial), for each time the processor requests data from one memory address. By assumption, the data that existed at the next address will be shaped by the sequential data in the previous address. This technique can be implemented to read and write operations.

   
A. f. CAS
(Column Address Select / Strobe) is a control pin that is on a DRAM chip that is used to select and activate the column addresses in memory. A selected column in the DRAM, the data are determined by the address pins when CAS becomes active.

   
A. g. CAS Latency
A delay or time delay of a memory speed when transferring data to the CPU. Thus, the smaller the latency values ​​are used, indicating a higher-speed memory that is faster response and greater transfer rate. Latency 2 memory with generally better quality than the Latency 3.

   
A. h. Chipset Module
There is a row of chips on the memory chip. Usually a single chip capacity in the memory depends on how much data capacity can be accommodated on a chipset chipset multiplied by how many pieces of the complete chip memory.

   
A. 7. Speaker
         
A. a. Audio Control Pad
Speaker is supporting devices that can change the settings on the speakers or the sound produced by a kind of equalizer. One Line in auxilary input line of speakers or audio devices that can be used by the audio output device, such as PC, Player, TV, and so forth.

   
A. b. Dolby Digital
One of the technologies to produce digital surround sound. Typically, these technologies are used in processing and audio data for the formation of films in theaters or movies on-chip media such as DVD's. To optimize the Dolby Digital technology developed by Dolby Laboratories, it takes at least 5 full-range speakers and a low-frequency speaker (subwoofer). Or it could be called a 6-channel configuration.

   
A. c. Driver or tranducer
Is another name of the speaker itself, which does not include cribs and other electronic components such as amplifiers. The size of each driver is usually determined from the speakers with a membrane diameter inches.

   
A. d. Equalizer
Tool to improve the quality of the received frequency of a transmission circuit. These devices are usually coupled with other transmission equipment.

   
A. e. High Frequency LevelHigh level in the audio frequency, usually between 3 KHz and 16 KHz or more identical with the title treble.

   
A. f. Level Low Frequency
Low level audio frequencies, typically ranging between 20 Hz and 300 Hz or more commonly called the bass.

   
A. g. Level Mid Frequency
Intermediate level in the audio frequency, usually between 300 Hz and 3 KHz

   
A. h. Optical
The process of transmitting data, audio and data either other, in the form of light media. This process form data in a digital data, so this process requires a processor to perform encoding and decoding data. And the use of light media, the purity of the quality of data will not be disturbed.

   
A. i. PMPO
Peak Music Power Output, optimal sound output power can be produced by a speaker. PMPO value is usually obtained from the maximum wattage before amplifi er in a faulty condition.

   
A. j. Sealed Speaker
This type of speaker that has no ports or ventilation holes on the speaker box design used, which is usually useful in helping the reproduction of sound. The speakers of this type typically used to handle low and medium frequencies.

   
A. k. Surround
In terms of sound, surround is a concept for expanding the reach of the creation of audio from the standard form one dimension (mono / stereo), a form of 2D or 3D. And, will give the impression of surround sound listeners.

   
A. 8. PC Case
         
A. a. Add-on Card
Place in addition to PC card.

   
A. b. Drive Bay
Slots are usually located on the top front of the PC Case that serves as a place for hard drives, floppy drives, or optical drive.

   
A. c. PSU (Power Supply Unit)
Part of the case on the PC that provides power to the motherboard and connected directly to AC electric power.

   
A. d. SPL (Sound Pressure Level)
Pointer gauges or noise levels are usually in units of dB (decibels).

   
A. e. Free Installation Tools
Installation of a device without the need for additional tools such as screwdrivers and pliers.

   
A. f. Tray
Part by part on a device like the PC case that can dipisahpisahkan or separated, usually rectangular plate-shaped plate.

souce : http://joko-pramono.web.ugm.ac.id/?p=12

1 comment:

  1. Great article. This is full of information and totally guidance for those who want to know more about computer component and function. This information is very useful for me. I really like it. Thanks for sharing.
    PC Richards

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